2023 - Semiconductor Wafer Inspection & Alignment Platform

Project Overview

In 2023, a semiconductor OEM required a compact, high-stiffness motion platform for 300 mm wafer probing. The system needed XY travel, rotary alignment, and high-speed positioning without mechanical backlash.

Equipment Supplied

• Wafer Prober / Inspection Stage — 300 mm wafer test platform

Yousee.Tech Components

• Precision Alignment Platform | XYθ & Custom
• Hollow Rotary Platform | TSH / TSN / TSB / TSG Series
• Linear Motor | TMZ & TLC Series

Implementation

Direct-drive linear motors provided frictionless, high-response XY motion. The XYθ alignment platform handled fine positional and angular corrections, while a hollow rotary platform enabled coaxial optics and vacuum routing through the center bore.

Results

• Positioning accuracy ±0.5 µm, repeatability ±0.3 µm
• Wafer throughput increased by 30%
• Rotary runout below 5 µm

Project Snapshot

• Year: 2023
• Client: A semiconductor equipment OEM in Suzhou
• Equipment: Wafer Prober / Inspection Stage
• Yousee.Tech Products: Precision Alignment Platform | XYθ & Custom, Hollow Rotary Platform | TSH / TSN / TSB / TSG Series, Linear Motor | TMZ & TLC Series