Project Overview
In 2023, a semiconductor OEM required a compact, high-stiffness motion platform for 300 mm wafer probing. The system needed XY travel, rotary alignment, and high-speed positioning without mechanical backlash.
Equipment Supplied
- Wafer Prober / Inspection Stage — 300 mm wafer test platform
Yousee.Tech Components
- Precision Alignment Platform | XYθ & Custom
- Hollow Rotary Platform | TSH / TSN / TSB / TSG Series
- Linear Motor | TMZ & TLC Series
Implementation
Direct-drive linear motors provided frictionless, high-response XY motion. The XYθ alignment platform handled fine positional and angular corrections, while a hollow rotary platform enabled coaxial optics and vacuum routing through the center bore.
Results
- Positioning accuracy ±0.5 µm, repeatability ±0.3 µm
- Wafer throughput increased by 30%
- Rotary runout below 5 µm
Project Snapshot
- Year: 2023
- Client: A semiconductor equipment OEM in Suzhou
- Equipment: Wafer Prober / Inspection Stage
- Yousee.Tech Products: Precision Alignment Platform | XYθ & Custom, Hollow Rotary Platform | TSH / TSN / TSB / TSG Series, Linear Motor | TMZ & TLC Series